MPVZ2202 rev 0, 09/2006 freescale semiconductor technical data ? freescale semiconductor, in c., 2006. all rights reserved. 200 kpa on-chip temperature compensated & calibrated pressure sensors the MPVZ2202 device series is a silicon piezoresistive pressure sensor providing a highly accurate and linear volt age output - directly proportional to the applied pressure. the sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. the chip is laser trimmed for precise span and offset calib ration and temperature compensation. they are designed for use in applications such as pump/motor controllers, robotics, level indicators, medical diagnostics, pressure switching and respiratory equipment. features ? temperature compensated over 0 c to +85 c ? easy-to-use chip carrier package options ? increased media compatibility fluorocarbon gel typical applications ? pump/motor controllers ? robotics ? level indicators ? medical diagnostics ? pressure switching ? respiratory equipment ordering information device type options case no. mpx series order no. packing options device marking small outline package (MPVZ2202 series) ported elements gauge, vertical port, surface mount 482a MPVZ2202gc6t1 tape and reel MPVZ2202g gauge, vertical port, through hole 482c MPVZ2202gc7u tube MPVZ2202g MPVZ2202 series 0 to 200 kpa (0 to 29 psi) 40 mv full scale span (typical) MPVZ2202gc6t1 case 482a-01 small outline package surface mount MPVZ2202gc7u case 482c-03 small outline package pin numbers 1 gnd (1) 1. pin 1 is noted by the notch in the lead. 5 n/c 2 +v out 6 n/c 3 v s 7 n/c 4 v s 8 n/c
MPVZ2202 sensors 2 freescale semiconductor figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. figure 1. temperature compensated pressure sensor schematic voltage output versus applied differential pressure the differential voltage output of the sensor is directly proportional to the differential pressure applied. the output voltage of the diff erential or gauge sensor increases with increasing pressure applied to the pressure (p1) side relative to the vacuum (p2) side. similarly, output voltage increases as increasing vacuum is applied to the vacuum (p2) side relative to the pressure (p1) side. v s sensing element v out+ v out- 2 3 4 1 thin film temperature compensation and calibration circuitry gnd table 1. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damag e or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 800 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c
MPVZ2202 sensors freescale semiconductor 3 table 2. operating characteristics (v s = 10 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristics symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0?200kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. operating the device above th e specified excitation range may i nduce additional error due to device self-heating. v s ?1016vdc supply current i o ?6.0?madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fss 38.5 40 41.5 mv offset (4) 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off -1.0 ? 1.0 mv sensitivity ? v/ ? p? 0.2 ?mv/kpa linearity (5) MPVZ2202d serie 5. accuracy (error budget) c onsists of the following: ? linearity: output deviation from a straig ht line relationship with pressure, usi ng end point method, over the specified pressure range. ? temperature hysteresis:output deviation at any temperature within the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within t he specified range, when this pressu re is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with mini mum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? -0.6 ? 0.4 %v fss pressure hysteresis (5) (0 to 200 kpa) ?? 0.1 ? %v fss temperature hysteresis (5) (-40 c to +125 c) ?? 0.5 ? %v fss temperature effect on full scale span (5) tcv fss -2.0 ? 2.0 %v fss temperature effect on offset (5) tcv off -1.0 ? 1.0 mv input impedance z in 1000 ? 2500 w output impedance z out 1400 ? 3000 w response time (6) (10% to 90%) 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms warm-up ? ? 20 ? ms offset stability (7) 7. offset stability is the product's output deviation when subjec ted to 1000 hours of pulsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
MPVZ2202 sensors 4 freescale semiconductor linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 2 ) or (2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (l ower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. linearity specification comparison on-chip temperature compensation and calibration figure 3 shows the output characteristics of the MPVZ2202 series at 25c. the out put is directly proportional to the differential pressure and is essentially a straight line. the effects of temperature on full scale span and offset are very small and are shown under operating characteristics. figure 3. output versus pressure differential least square deviation relative voltage output pressure (% fullscale) 0 50 100 end point straight line fit exaggerated performance curve least squares fit straight line deviation offset output (mvdc) vs = 10 vdc ta = 25c p1 > p2 40 35 30 25 20 15 10 5 0 -5 typ max min span range ( typ ) offset ( typ ) 0 50 100 150 200 kpa psi 7.25 14.5 21.75 29 175 125 75 25 pressure
MPVZ2202 sensors freescale semiconductor 5 figure 4. cross-sectional diagram (not to scale) figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (case 344). a gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. media other than dry clean air may have adverse effects on sensor performance and long term reliability. contact the factory for information regarding media compatibility in your application. pressure (p1)/vacuum (p2) side identification table freescale designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing the gel which isolates the die from the envi ronment. the differential or gauge sensor is designed to operate with positive differential pressure applied, p1 > p2. the absolute sensor is designed for vacuum applied to p1 side. the pressure (p1) side may be identified by using the table below: gel die coat wire bond die p1 stainless steel cap thermoplastic case die bond differential sensing element p2 lead frame table 3. pressure (p1)/vacuum (p2) side id entification table part number case type pressure (p1) side identifier MPVZ2202gc6t1 482a top with port attached MPVZ2202gc7u 482c top with port attached
package dimensions MPVZ2202 sensors 6 freescale semiconductor dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 s b m 0.25 (0.010) a s t ?a? ?b? c m j k pin 1 identifier h seating plane ?t? n v w v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 case 482a-01 issue a small outline package dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.66 0.034 0.026 0.864 g 0.100 bsc 2.54 bsc j 0.009 0.011 0.23 0.28 k 0.100 0.120 2.54 3.05 m 0 15 0 15 n 0.444 0.448 11.28 11.38 s 0.540 0.560 13.72 14.22 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. 6. dimension s to center of lead when formed parallel. pin 1 k seating plane ?t? s g 4 5 8 1 ?a? ?b? c n v w m j v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 identifier d 8 pl s b m 0.25 (0.010) a s t detail x detail x case 482c-03 issue b small outline package
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